Ceramic (Oxide, Carbide, Nitride, Boride,Antimonide, Silicide, Fluoride, Selenide, Sulfide, Telluride, Arsenide) sputtering target
Application:
Ceramics, Thin film coating, Optical thin film, Electric thin film, PVD thin film, Superconducting thin film, Protective thin film, surface thin film, IC coating, Vacuum evaporation coating, color coating, Optical Communication, Enameling, Display industry
Methods of production: Vacuum sinter, Vacuum hot press, Hot isostatic pressing (HIP), Cold isostatic pressing (CIP), Spraying, Pressure casting process
Machinery: Hot-press equipment, Hot/Cold rolling equipment, Hot/Cold isostatic pressing equipment, vacuum casting equipment, forging equipment, Surface grinding machine, Precision turning machine,
Diameter:
Diameter: 355.6mm (14") max.
Single piece Size: Length: <254mm, Width: <127mm, Thickness: >1mm, if larger size than this, we can do it as tiles joint by 45 degree or 90 degree.
Most of those material can be offered in powder, lump, pellet, rod, sheet, tablets, discs, plate, tube made from hot press or cold press or vacuum sinter.
Purity: 99.5%
Borides target:
Cu3B2,
CrB2,
Cr2B,
CeB6,
DyB6,
GdB6,
LaB6,
ReB2,
TiB2,
TaB2,
MoB2,
VB2,
HfB2,
Mo2B5,
NiB,
NbB,
W2B5,
W2B,
WB,
ZrB2.
